Gold Plating US
Copper

Copper Plating

Superb leveling, excellent conductivity, outstanding adhesion.

Copper plating is the foundation layer beneath most bright finishes we produce, and a capable finish in its own right for electronics, heat management, and electroforming.

The process deposits a ductile, highly conductive layer of copper. Its exceptional throwing and leveling power makes it ideal for smoothing a surface before a bright top finish, and its conductivity and ductility make it valuable in electronics and electroforming. Copper is soft, so it usually serves as a base layer rather than a final decorative surface.

Properties & Benefits

Conductivity

Excellent electrical and thermal conductivity for electronics, bus connections, and heat-sinking.

Leveling and throwing power

Smooths and fills the surface — fine imperfections disappear beneath the deposit.

Ductile and buildable

Highly ductile and easy to build up in thickness for electroforming and repair work.

Adhesion base

A strong foundation for nickel, gold, silver, and chrome top layers, and a useful mask for selective heat-treatment processes.

Best For

Specifications

Copper's leveling ability lets it fill fine surface imperfections, giving subsequent nickel and gold layers a smoother, brighter base. Because it is soft and will oxidize, it is almost always followed by a harder or more stable top layer for finished parts. For copper-rich substrates like brass and bronze, an anti-diffusion nickel underplate is used before gold to prevent migration.

Pricing

Copper plating starts at our $500 minimum and is quoted firm at $100 per square inch after a photo review. See pricing details.

Frequently Asked Questions

It can for functional and electronic parts, though it will oxidize over time. For decorative work it is typically topped with a more stable finish.

Ready to get started? Send us a photo of your item.

Most quotes take one photo and one business day. Text or WhatsApp a picture and we'll take it from there.

Call (760) 458-3299